| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 8 |
| Number of Inputs per Chip | 8 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 8 |
| Number of Output Enables per Chip | 1 Low/1 High |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 130@2V|22@6V|26@4.5V |
| Absolute Propagation Delay Time (ns) | 205 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 7.8 |
| Maximum High Level Output Current (mA) | -7.8 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Quiescent Current (uA) | 4 |
| Propagation Delay Test Condition (pF) | 150 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Magazine |
| Mounting | Through Hole |
| Package Height | 3.5 |
| Package Width | 6.4 |
| Package Length | 25.1(Max) |
| PCB changed | 20 |
| Standard Package Name | DIP |
| Supplier Package | PDIP |
| Pin Count | 20 |
| Lead Shape | Through Hole |
