| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Obsolete |
| Código HTS | 8542.32.00.32 |
| Automotive | No |
| PPAP | No |
| DRAM Type | Mobile LPDDR2 SDRAM |
| Chip Density (bit) | 1G |
| Organization | 32Mx32 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 4M |
| Number of Bits/Word (bit) | 32 |
| Data Bus Width (bit) | 32 |
| Maximum Clock Rate (MHz) | 400 |
| Maximum Access Time (ns) | 5.5 |
| Address Bus Width (bit) | 16 |
| Interface Type | HSUL_12 |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Maximum Operating Supply Voltage (V) | 1.3|1.95 |
| Operating Current (mA) | 200 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Number of I/O Lines (bit) | 32 |
| Mounting | Surface Mount |
| Package Height | 0.45 mm |
| Package Width | 12 mm |
| Package Length | 12 mm |
| PCB changed | 168 |
| Standard Package Name | BGA |
| Supplier Package | WFBGA |
| Pin Count | 168 |
| Lead Shape | Ball |
