Flash
SM668GX2-AC
SLC NAND Flash Serial e-MMC 16G-bit Automotive AEC-Q100 153-Pin BGA Tray
Silicon Motion TechnologyEspecificaciones técnicas del producto
RoHS (Unión Europea)
Compliant
ECCN (Estados Unidos)
EAR99
Estatus de pieza
Unconfirmed
Código HTS
8542.32.00.71
Automotive
Unknown
PPAP
Yes
Mounting
Surface Mount
Package Height
1.4 mm
Package Width
14 mm
Package Length
18 mm
PCB changed
153
Standard Package Name
BGA
Supplier Package
BGA
Pin Count
153
Lead Shape
Ball

