RoHS (Union Européenne) | Compliant |
ECCN (États-Unis) | EAR99 |
Statut de pièce | Active |
Code HTS | 8542.33.00.01 |
Automotive | No |
PPAP | No |
Installation | Surface Mount |
Hauteur du paquet | 1.1 |
Largeur du paquet | 1.75(Max) |
Longueur du paquet | 3.05(Max) |
Carte électronique changée | 6 |
Nom de lemballage standard | SOT |
Conditionnement du fournisseur | SOT-23 |
Décompte de broches | 6 |
Forme de sonde | Gull-wing |
Not receiving the proper signal? This cascadable amplifier THS9001DBVT buffer amplifier manufactured from Texas Instruments, will help clean up the signal. Its maximum power dissipation is 463 mW. This RF amplifier chip has a temperature range of -40 °C to 85 °C. This product will be shipped in tape and reel packaging so that components can be mounted effectively. It has a single channel per chip. This device uses a single power supply.