RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | 8542.39.00.60 |
Automotive | No |
PPAP | No |
Driver Type | High and Low Side |
Driver Configuration | Inverting |
Bridge Type | 3-Phase Bridge |
Number of Drivers | 6 |
High and Low Sides Dependency | Independent |
Type | IGBT|MOSFET |
Number of Outputs | 6 |
Maximum Rise Time (ns) | 150 |
Maximum Fall Time (ns) | 70 |
Input Logic Compatibility | 2.5V(Min)|CMOS|LSTTL |
Minimum Operating Supply Voltage (V) | 10 |
Maximum Operating Supply Voltage (V) | 20 |
Typical Input Low Threshold Voltage (V) | 0.8(Max) |
Typical Input High Threshold Voltage (V) | 2.2(Min) |
Maximum Power Dissipation (mW) | 1600 |
Maximum Operating Temperature (°C) | 125 |
Special Features | Current Sensing|Undervoltage Lockout |
Maximum Turn-On Delay Time (ns) | 1000 |
Maximum Turn-Off Delay Time (ns) | 950 |
Packaging | Tube |
Mounting | Surface Mount |
Package Height | 2.35(Max) |
Package Width | 7.6(Max) |
Package Length | 18.1(Max) |
PCB changed | 28 |
Standard Package Name | SO |
Supplier Package | SOIC W |
Pin Count | 28 |
Lead Shape | Gull-wing |