| RoHS (Unione Europea) | Compliant |
| ECCN (Stati Uniti) | 3A991d.1. |
| Stato del componente | Active |
| Codice HTS | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | LatticeECP3 |
| User I/Os | 133 |
| Process Technology | 65nm |
| Number of I/O Banks | 7 |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 17000 |
| Number of Multipliers | 24 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 700 |
| Total Number of Block RAM | 38 |
| Maximum Distributed RAM Bits | 36864 |
| SERDES Channels | 4 |
| Device Logic Units | 17000 |
| Number of Global Clocks | 16 |
| Device Number of DLLs/PLLs | 2+2 |
| Dedicated DSP | 12 |
| Programmability | Yes |
| Reprogrammability Support | No |
| Copy Protection | No |
| In-System Programmability | No |
| Speed Grade | 6 |
| Maximum I/O Performance | 3.2Gbps |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| I/O Voltage (V) | 1.2|1.5|1.8|2.5|3.3 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tray |
| Tradename | LatticeEC |
| Mounting | Surface Mount |
| Package Height | 1.25(Max) |
| Package Width | 17 |
| Package Length | 17 |
| PCB changed | 256 |
| Standard Package Name | BGA |
| Supplier Package | FTBGA |
| Pin Count | 256 |
| Lead Shape | Ball |
