RoHS (Unione Europea) | Compliant |
ECCN (Stati Uniti) | EAR99 |
Stato del componente | Active |
Codice HTS | 8542.33.00.01 |
Automotive | No |
PPAP | No |
Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 1 |
Process Technology | BiCOM |
Maximum Input Offset Voltage (mV) | 4@±5V |
Minimum Dual Supply Voltage (V) | ±2.5 |
Typical Dual Supply Voltage (V) | ±12|±3|±5|±9 |
Maximum Dual Supply Voltage (V) | ±15 |
Maximum Input Offset Current (uA) | 0.4@±5V |
Maximum Input Bias Current (uA) | 8@±5V |
Maximum Supply Current (mA) | 9@±5V |
Typical Output Current (mA) | 40@±5V |
Power Supply Type | Dual |
Typical Slew Rate (V/us) | 250@±15V |
Typical Input Noise Voltage Density (nV/rtHz) | 22@±15V |
Input Offset Voltage Drift (uV/°C) | 25(Typ) |
Typical Voltage Gain (dB) | 76.9 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@±15V |
Minimum PSRR (dB) | 75 |
Minimum CMRR (dB) | 86 |
Minimum CMRR Range (dB) | 85 to 90 |
Typical Gain Bandwidth Product (MHz) | 34 |
Typical Settling Time (ns) | 90 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
Packaging | Tube |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Width | 3.99(Max) |
Package Length | 5(Max) |
PCB changed | 8 |
Standard Package Name | SO |
Supplier Package | SOIC N |
Pin Count | 8 |
Lead Shape | Gull-wing |