| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.33.00.01 |
| Automotive | No |
| PPAP | No |
| Type | High Speed Amplifier |
| Manufacturer Type | High Speed Amplifier |
| Number of Channels per Chip | 1 |
| Process Technology | BiCOM |
| Maximum Input Offset Voltage (mV) | 4@±5V |
| Minimum Dual Supply Voltage (V) | ±2.5 |
| Typical Dual Supply Voltage (V) | ±12|±3|±5|±9 |
| Maximum Dual Supply Voltage (V) | ±15 |
| Maximum Input Offset Current (uA) | 0.4@±5V |
| Maximum Input Bias Current (uA) | 8@±5V |
| Maximum Supply Current (mA) | 9@±5V |
| Typical Output Current (mA) | 40@±5V |
| Power Supply Type | Dual |
| Typical Slew Rate (V/us) | 250@±15V |
| Typical Input Noise Voltage Density (nV/rtHz) | 22@±15V |
| Input Offset Voltage Drift (uV/°C) | 25(Typ) |
| Typical Voltage Gain (dB) | 76.9 |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@±15V |
| Minimum PSRR (dB) | 75 |
| Minimum CMRR (dB) | 86 |
| Minimum CMRR Range (dB) | 85 to 90 |
| Typical Gain Bandwidth Product (MHz) | 34 |
| Typical Settling Time (ns) | 90 |
| Shut Down Support | No |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tube |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 3.99(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| Lead Shape | Gull-wing |
