| 유럽 연합 RoHS 명령어 | Compliant |
| 미국수출통제분류ECCN 인코딩 | EAR99 |
| 친환경 무연 | Unconfirmed |
| 미국 세관 상품 코드 | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | MAX 10 |
| User I/Os | 112 |
| Process Technology | 55nm |
| Shift Registers | Utilize Memory |
| Operating Supply Voltage (V) | 3.3 |
| Logic Elements | 8000 |
| Number of Multipliers | 24 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 378 |
| Device Logic Units | 8000 |
| Number of Global Clocks | 10 |
| Device Number of DLLs/PLLs | 2 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Speed Grade | 7 |
| Differential I/O Standards | HSUL|LVDS|SSTL |
| External Memory Interface | DDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM|LPDDR2 SDRAM |
| Minimum Operating Supply Voltage (V) | 3.135 |
| Maximum Operating Supply Voltage (V) | 3.465 |
| I/O Voltage (V) | 1.2|1.35|1.5|1.8|2.5|3|3.3 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Temperature Grade | Industrial |
| Mounting | Surface Mount |
| Package Height | 0.68 |
| Package Width | 8 |
| Package Length | 8 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | Micro FBGA |
| Pin Count | 153 |
| Lead Shape | Ball |
