| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | Active |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | AUP |
| Logic Function | NAND |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 11.8@1.4V to 1.6V|22@1.1V to 1.3V|6.5@3V to 3.6V|7.1@2.3V to 2.7V|9.3@1.65V to 1.95V |
| Absolute Propagation Delay Time (ns) | 24.9 |
| Process Technology | CMOS |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Minimum Operating Temperature (ยฐC) | -40 |
| Maximum Operating Temperature (ยฐC) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.28 |
| Package Width | 0.8 |
| Package Length | 0.8 |
| PCB changed | 4 |
| Standard Package Name | DFN |
| Supplier Package | X2-DFN EP |
| Pin Count | 4 |
| Lead Shape | No Lead |
