| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | Active |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.39.00.60 |
| Automotive | Unknown |
| PPAP | Unknown |
| Logic Family | AUP |
| Logic Function | Buffer/Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 2 |
| Number of Inputs per Chip | 2 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 2 |
| Number of Output Enables per Chip | 0 |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 15.6@1.1V to 1.3V|6.7@2.3V to 2.7V|9.4@1.4V to 1.6V|9.7@3V to 3.6V |
| Absolute Propagation Delay Time (ns) | 20.7 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | Open Drain |
| Maximum Low Level Output Current (mA) | 4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Operating Temperature (ยฐC) | -40 |
| Maximum Operating Temperature (ยฐC) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.3 |
| Package Width | 0.8 |
| Package Length | 1 |
| PCB changed | 6 |
| Standard Package Name | SON |
| Supplier Package | X2SON |
| Pin Count | 6 |
