| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | Active |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.39.00.60 |
| Automotive | Yes |
| PPAP | Unknown |
| Logic Family | LVC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 4 |
| Number of Channels per Chip | 4 |
| Number of Inputs per Chip | 4 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 4 |
| Number of Output Enables per Chip | 4 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.5(Typ)@3.3V|2.8(Typ)@2.7V |
| Absolute Propagation Delay Time (ns) | 14.2 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 24 |
| Maximum High Level Output Current (mA) | -24 |
| Minimum Operating Supply Voltage (V) | 1.2 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Tolerant I/Os (V) | 5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (ยฐC) | -40 |
| Maximum Operating Temperature (ยฐC) | 125 |
| Supplier Temperature Grade | Automotive |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 8.75(Max) |
| PCB changed | 14 |
| Standard Package Name | SO |
| Supplier Package | SO |
| Pin Count | 14 |
