์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Not Compliant |
๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
์นํ๊ฒฝ ๋ฌด์ฐ | Active |
๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.33.00.01 |
SVHC | Yes |
SVHC ๊ธฐ์ค ์ด๊ณผ | Yes |
Automotive | No |
PPAP | No |
Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 1 |
Process Technology | BiCOM |
Maximum Input Offset Voltage (mV) | 0.5@ยฑ5V |
Minimum Dual Supply Voltage (V) | ยฑ4.5 |
Typical Dual Supply Voltage (V) | ยฑ12|ยฑ15|ยฑ5|ยฑ9 |
Maximum Dual Supply Voltage (V) | ยฑ18 |
Maximum Input Offset Current (uA) | 0.5@ยฑ15V |
Maximum Input Bias Current (uA) | 7@ยฑ5V |
Power Supply Type | Dual |
Maximum Power Dissipation (mW) | 1300 |
Typical Slew Rate (V/us) | 150@ยฑ5V |
Typical Input Noise Voltage Density (nV/rtHz) | 1.7@ยฑ15V |
Typical Voltage Gain (dB) | 96.26 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@ยฑ15V |
Minimum PSRR (dB) | 98 |
Minimum CMRR (dB) | 100 |
Minimum CMRR Range (dB) | 95 to 105 |
Typical Gain Bandwidth Product (MHz) | 600 |
Typical Settling Time (ns) | 65 |
Shut Down Support | No |
Minimum Operating Temperature (ยฐC) | -55 |
Maximum Operating Temperature (ยฐC) | 125 |
Supplier Temperature Grade | Military |
Packaging | Tube |
Mounting | Through Hole |
Package Height | 3.56(Max) |
Package Width | 7.87(Max) |
Package Length | 10.29(Max) |
PCB changed | 8 |
Standard Package Name | DIP |
Supplier Package | CDIP |
Pin Count | 8 |
Lead Shape | Through Hole |