| 유럽 연합 RoHS 명령어 | Compliant |
| 미국수출통제분류ECCN 인코딩 | EAR99 |
| 친환경 무연 | Obsolete |
| 미국 세관 상품 코드 | 8542.32.00.36 |
| Automotive | No |
| PPAP | No |
| DRAM Type | Mobile LPDDR2 SDRAM |
| Chip Density (bit) | 16G |
| Organization | 512Mx32 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 64M |
| Number of Bits/Word (bit) | 32 |
| Data Bus Width (bit) | 32 |
| Maximum Clock Rate (MHz) | 533 |
| Address Bus Width (bit) | 14 |
| Interface Type | HSUL |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Maximum Operating Supply Voltage (V) | 1.3|1.95 |
| Operating Current (mA) | 160 |
| Minimum Operating Temperature (°C) | -30 |
| Maximum Operating Temperature (°C) | 85 |
| Number of I/O Lines (bit) | 32 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.65 |
| Package Width | 12 |
| Package Length | 12 |
| PCB changed | 168 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 168 |
| Lead Shape | Ball |
