유럽 연합 RoHS 명령어 | Compliant |
미국수출통제분류ECCN 인코딩 | 3A991.b.1.a |
친환경 무연 | Active |
미국 세관 상품 코드 | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Cell Type | NOR |
Chip Density (bit) | 128M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Bottom|Top |
Address Width (bit) | 25/24 |
Sector Size | 128Kbyte x 128 |
Page Size | 8Words/16byte |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 16M/8M |
Programmability | Yes |
Timing Type | Asynchronous |
Max. Access Time (ns) | 70 |
Maximum Erase Time (s) | 150/Chip |
Maximum Page Access Time (ns) | 20 |
Maximum Programming Time (ms) | 0.2/Byte |
OE Access Time (ns) | 35 |
Process Technology | CMOS |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 45 |
Page Read Current (mA) | 15 |
Program Current (mA) | 40 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Temperature Grade | Extended |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | Yes |
Mounting | Surface Mount |
Package Height | 0.8(Max) |
Package Width | 11 |
Package Length | 13 |
PCB changed | 64 |
Standard Package Name | BGA |
Supplier Package | LFBGA |
Pin Count | 64 |
Lead Shape | Ball |