| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | LTB |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.32.00.28 |
| Automotive | No |
| PPAP | No |
| DRAM Type | DDR SDRAM |
| Chip Density (bit) | 512M |
| Organization | 32Mx16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 8M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 166 |
| Maximum Access Time (ns) | 0.7 |
| Address Bus Width (bit) | 15 |
| Process Technology | CMOS |
| Interface Type | SSTL_2 |
| Minimum Operating Supply Voltage (V) | 2.3 |
| Typical Operating Supply Voltage (V) | 2.5 |
| Maximum Operating Supply Voltage (V) | 2.7 |
| Operating Current (mA) | 370 |
| Minimum Operating Temperature (ยฐC) | 0 |
| Maximum Operating Temperature (ยฐC) | 70 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Width | 8 |
| Package Length | 13 |
| PCB changed | 60 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 60 |
| Lead Shape | Ball |
