| ์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
| ๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
| ์นํ๊ฒฝ ๋ฌด์ฐ | Active |
| ๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8542.39.00.60 |
| Automotive | Yes |
| PPAP | No |
| Type | SPI|I2C |
| Number of Channels per Chip | 6 |
| Maximum Data Rate | 20Mbps |
| Maximum Rise Time (ns) | 250 |
| Maximum Fall Time (ns) | 250 |
| Output Type | Logic |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 500 |
| Minimum Isolation Voltage (Vrms) | 4200 |
| Maximum Propagation Delay Time (tPLH) (ns) | 350 |
| Maximum Working Insulation Voltage | 850Vp |
| Minimum Operating Temperature (ยฐC) | 0 |
| Maximum Operating Temperature (ยฐC) | 70 |
| Packaging | Tray |
| Forward/Reverse Channels | 3/3 |
| Minimum Common Mode Rejection (kV/us) | 50 |
| Maximum ESD Protection Voltage (kV) | ยฑ15@HBM |
| Supplier Temperature Grade | Commercial |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 2.41 mm |
| Package Width | 6.25 mm |
| Package Length | 9 mm |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 24 |
| Lead Shape | Ball |
