์ ๋ฝ ์ฐํฉ RoHS ๋ช
๋ น์ด | Compliant |
๋ฏธ๊ตญ์์ถํต์ ๋ถ๋ฅECCN ์ธ์ฝ๋ฉ | EAR99 |
์นํ๊ฒฝ ๋ฌด์ฐ | Unconfirmed |
๋ฏธ๊ตญ ์ธ๊ด ์ํ ์ฝ๋ | 8541.49.80.00 |
Automotive | No |
PPAP | No |
Output Type | DC |
Input Type | DC |
Output Device | Transistor |
Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 5000 |
Minimum Operating Temperature (ยฐC) | -55 |
Maximum Operating Temperature (ยฐC) | 110 |
Maximum Forward Voltage (V) | 1.4 |
Maximum Collector-Emitter Voltage (V) | 35 |
Maximum Current Transfer Ratio (%) | 400 |
Standard | BSI|CSA|DEMKO|FIMKO|NEMKO|SEMKO|UL|VDE |
Maximum Collector Current (mA) | 50 |
Maximum Collector-Emitter Saturation Voltage (mV) | 200 |
Maximum Power Dissipation (mW) | 200 |
Maximum Reverse Voltage (V) | 6 |
Typical Forward Voltage (V) | 1.2 |
Maximum Rise Time (us) | 18 |
Maximum Fall Time (us) | 18 |
Maximum Forward Current (mA) | 50 |
Minimum Current Transfer Ratio (%) | 200 |
Current Transfer Ratio Test Current (mA) | 5 |
Typical Rise Time (us) | 4 |
Typical Fall Time (us) | 3 |
Mounting | Through Hole |
Package Height | 3.5 |
Package Width | 6.5 |
Package Length | 4.6 |
PCB changed | 4 |
Standard Package Name | DIP |
Supplier Package | DIP |
Pin Count | 4 |
Lead Shape | Wide Lead Spacing Through Hole |