| 유럽 연합 RoHS 명령어 | Compliant |
| 미국수출통제분류ECCN 인코딩 | EAR99 |
| 친환경 무연 | Active |
| 미국 세관 상품 코드 | 8542.32.00.36 |
| Automotive | Yes |
| PPAP | Yes |
| DRAM Type | DDR3L SDRAM |
| Chip Density (bit) | 4G |
| Organization | 256Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 32M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 1866 |
| Maximum Access Time (ns) | 0.195 |
| Address Bus Width (bit) | 18 |
| Process Technology | CMOS |
| Minimum Operating Supply Voltage (V) | 1.283 |
| Typical Operating Supply Voltage (V) | 1.35 |
| Maximum Operating Supply Voltage (V) | 1.45 |
| Operating Current (mA) | 130 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Number of I/O Lines (bit) | 16 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.92 |
| Package Width | 8 |
| Package Length | 14 |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 96 |
| Lead Shape | Ball |
