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Winbond ElectronicsW71NW20GF3FW | Multi-Chip Packaged (MCP) MemoryMulti-Chip Package Memory
MCP 16Mx8 Flash + 2Mx32 DDR2 DRAM 1.8V 162-Pin VFBGA
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| 2G | |
| 1G | |
| 16Mx8 Flash + 2Mx32 DDR2 DRAM | |
| Yes | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| -40 | |
| 85 | |
| Industrial | |
| Mounting | Surface Mount |
| Package Height | 0.73(Max) |
| Package Width | 8 |
| Package Length | 10.5 |
| PCB changed | 162 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 162 |
| EDA / CAD Models |