| 유럽 연합 RoHS 명령어 | Compliant |
| 미국수출통제분류ECCN 인코딩 | EAR99 |
| 친환경 무연 | Active |
| 미국 세관 상품 코드 | 8542.32.00.02 |
| Automotive | No |
| PPAP | No |
| DRAM Type | DDR2 SDRAM |
| Chip Density (bit) | 128M |
| Organization | 8Mx16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 2M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Access Time (ns) | 0.4 |
| Address Bus Width (bit) | 15 |
| Interface Type | SSTL_18 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Operating Current (mA) | 135 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) mm |
| Package Width | 8 mm |
| Package Length | 12.5 mm |
| PCB changed | 84 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 84 |
| Lead Shape | Ball |
