Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS Automotive AEC-Q100 6-Pin XSON T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | Yes |
| PPAP | Unknown |
| Logic Family | AUP |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Number of Inputs per Chip | 1 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 1 |
| Number of Output Enables per Chip | 1 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 19@1.1V to 1.3V|10.8@1.4V to 1.6V|8.4@1.65V to 1.95V|6.3@2.3V to 2.7V|5.8@3V to 3.6V |
| Absolute Propagation Delay Time (ns) | 25.3 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.46(Max) mm |
| Package Width | 1 mm |
| Package Length | 1.45 mm |
| PCB changed | 6 |
| Standard Package Name | SON |
| Supplier Package | XSON |
| Pin Count | 6 |
| EDA / CAD Models |
|
A datasheet is only available for this product at this time.
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Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS Automotive AEC-Q100 6-Pin XSON T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | Yes |
| PPAP | Unknown |
| Logic Family | AUP |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Number of Inputs per Chip | 1 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 1 |
| Number of Output Enables per Chip | 1 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 19@1.1V to 1.3V|10.8@1.4V to 1.6V|8.4@1.65V to 1.95V|6.3@2.3V to 2.7V|5.8@3V to 3.6V |
| Absolute Propagation Delay Time (ns) | 25.3 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.46(Max) mm |
| Package Width | 1 mm |
| Package Length | 1.45 mm |
| PCB changed | 6 |
| Standard Package Name | SON |
| Supplier Package | XSON |
| Pin Count | 6 |
| EDA / CAD Models |
A datasheet is only available for this product at this time.
制造商
