| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 8 |
| Number of Inputs per Chip | 8 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 8 |
| Number of Output Enables per Chip | 2 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 110@2V|22@4.5V|19@6V |
| Absolute Propagation Delay Time (ns) | 225 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 7.8 |
| Maximum High Level Output Current (mA) | -7.8 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Quiescent Current (uA) | 8 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) mm |
| Package Width | 4.5(Max) mm |
| Package Length | 6.6(Max) mm |
| PCB changed | 20 |
| Standard Package Name | SO |
| Supplier Package | TSSOP |
| Pin Count | 20 |
