| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | LVC |
| Logic Function | NAND |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 1.8(Typ)@4.5V to 5.5V|2.2(Typ)@3V to 3.6V|3(Typ)@2.7V |
| Absolute Propagation Delay Time (ns) | 10.8 |
| Process Technology | CMOS |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.31(Max) |
| Package Width | 0.8 |
| Package Length | 1.35 |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | X2SON |
| Pin Count | 8 |
