欧盟RoHS指令 | Compliant |
美国出口管制分类ECCN编码 | EAR99 |
环保无铅 | Active |
美国海关商品代码 | 8542.33.00.01 |
Automotive | No |
PPAP | No |
Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 1 |
Process Technology | BiCOM |
Maximum Input Offset Voltage (mV) | 1@±5V |
Minimum Dual Supply Voltage (V) | ±4.5 |
Typical Dual Supply Voltage (V) | ±12|±15|±5|±9 |
Maximum Dual Supply Voltage (V) | ±18 |
Maximum Input Offset Current (uA) | 0.3@±5V |
Maximum Input Bias Current (uA) | 6.6@±5V |
Power Supply Type | Dual |
Maximum Power Dissipation (mW) | 800 |
Typical Slew Rate (V/us) | 200@±5V |
Typical Input Noise Voltage Density (nV/rtHz) | 15@±15V |
Typical Voltage Gain (dB) | 70.88 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@±15V |
Minimum PSRR (dB) | 75 |
Minimum CMRR (dB) | 78 |
Minimum CMRR Range (dB) | 75 to 80 |
Typical Gain Bandwidth Product (MHz) | 35 |
Typical Settling Time (ns) | 140 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Packaging | Tape and Reel |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Width | 4(Max) |
Package Length | 5(Max) |
PCB changed | 8 |
Standard Package Name | SO |
Supplier Package | SOIC N |
Pin Count | 8 |
Lead Shape | Gull-wing |