欧盟RoHS指令 | Compliant |
美国出口管制分类ECCN编码 | 3A991a.2. |
环保无铅 | Active |
美国海关商品代码 | 8542.31.00.25 |
Automotive | No |
PPAP | No |
Instruction Set Architecture | RISC |
Device Core | ARM Cortex M3 |
Core Architecture | ARM |
Maximum CPU Frequency (MHz) | 80 |
Maximum Clock Rate (MHz) | 80 |
Data Bus Width (bit) | 32 |
Program Memory Type | Flash |
Program Memory Size | 256KB |
RAM Size | 32KB |
Programmability | Yes |
Interface Type | I2C/SPI/UART |
No. of Timers | 3 |
PWM | 1 |
Number of ADCs | Single |
ADC Channels | 16 |
ADC Resolution (bit) | 12 |
Number of DACs | Single |
DAC Channels | 8 |
DAC Resolution (bit) | 12 |
USART | 0 |
UART | 1 |
USB | 0 |
SPI | 2 |
I2C | 2 |
I2S | 0 |
CAN | 0 |
Ethernet | 0 |
Watchdog | 1 |
Analog Comparators | 1 |
Parallel Master Port | No |
Real Time Clock | No |
Minimum Operating Supply Voltage (V) | 2.9 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Power Dissipation (mW) | 1000 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 0.86 |
Package Width | 6 |
Package Length | 6 |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | CSP-BGA |
Pin Count | 96 |
Lead Shape | Ball |