| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | SPI |
| Number of Channels per Chip | 2 |
| Maximum Data Rate | 25Mbps |
| Maximum Rise Time (ns) | 2.5(Typ) |
| Maximum Fall Time (ns) | 2.5(Typ) |
| Minimum Pulse Width (ns) | 40 |
| Maximum Pulse Width Distortion (ns) | 3 |
| Maximum Propagation Delay Skew (ns) | 16 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5 |
| Minimum Operating Supply Voltage (V) | 3.3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 45 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 45 |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Quiescent Supply Current (mA) | 0.8 |
| Maximum Power Dissipation (mW) | 1560 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Forward/Reverse Channels | 1/1 |
| Minimum Common Mode Rejection (kV/us) | 25 |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| Lead Shape | Gull-wing |
