Infineon Technologies AGCY62187G30-55BAXISRAM 芯片
SRAM Chip Async Single 3V/3.3V 64M-bit 4M x 16 55ns 48-Pin FBGA Tray
| Compliant | |
| 3A991.b.2.a | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 1.14(Max) |
| Package Width | 8 |
| Package Length | 9.5 |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 48 | |
| Lead Shape | Ball |
| EDA / CAD Models |