Infineon Technologies AGCY7C2665KV18-550BZXISRAM 芯片
SRAM Chip Sync Dual 1.8V 144M-bit 4M x 36 0.45ns 165-Pin FBGA Tray
| Compliant | |
| 3A991b.2.a. | |
| Active | |
| 8542.32.00.41 | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.89 |
| Package Width | 15 |
| Package Length | 17 |
| PCB changed | 165 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 165 | |
| Lead Shape | Ball |
| EDA / CAD Models |