DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin FBGA T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.32.00.32 |
| Automotive | Unknown |
| PPAP | Unknown |
| DRAM Type | Mobile LPDDR2 SDRAM |
| Chip Density (bit) | 1G |
| Organization | 64Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 8M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 533 |
| Maximum Access Time (ns) | 5.5 |
| Address Bus Width (bit) | 13 |
| Interface Type | HSUL |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Maximum Operating Supply Voltage (V) | 1.3|1.95 |
| Operating Current (mA) | 155 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Supplier Temperature Grade | Automotive |
| Number of I/O Lines (bit) | 16 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.58(Min) |
| Package Width | 10 |
| Package Length | 11.5 |
| PCB changed | 134 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 134 |
| Lead Shape | Ball |
| EDA / CAD Models |
|
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DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin FBGA T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.32.00.32 |
| Automotive | Unknown |
| PPAP | Unknown |
| DRAM Type | Mobile LPDDR2 SDRAM |
| Chip Density (bit) | 1G |
| Organization | 64Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 8M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 533 |
| Maximum Access Time (ns) | 5.5 |
| Address Bus Width (bit) | 13 |
| Interface Type | HSUL |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Maximum Operating Supply Voltage (V) | 1.3|1.95 |
| Operating Current (mA) | 155 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Supplier Temperature Grade | Automotive |
| Number of I/O Lines (bit) | 16 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.58(Min) |
| Package Width | 10 |
| Package Length | 11.5 |
| PCB changed | 134 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 134 |
| Lead Shape | Ball |
| EDA / CAD Models |
制造商
