TechNexionEDMHSCP12200501
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.5 MM THICKNESS FOR LIDDED NXP CPUS + MYLAR
| EAR99 | |
| EA |
| EDA / CAD Models |
EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.5 MM THICKNESS FOR LIDDED NXP CPUS + MYLAR
| EAR99 | |
| EA |
| EDA / CAD Models |