Intel EP3C25F256C7N 现场可编程门阵列
FPGA Cyclone® III Family 24624 Cells 133MHz 65nm Technology 1.2V 256-Pin FBGA Tray
| Compliant | |
| EAR99 | |
| NRND | |
| 8542.31.00.60 | |
| SVHC | Yes |
| SVHC超标 | Yes |
| Automotive | No |
| PPAP | No |
| Cyclone® III | |
| 156 | |
| 65nm | |
| 8 | |
| 1.2 | |
| 24624 | |
| 66 (18x18) | |
| SRAM | |
| 594 | |
| 66 | |
| 10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|V1 ColdFire|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder | |
| Altera/Freescale/CAST, Inc/MorethanIP/PLDA | |
| 24624 | |
| 20 | |
| 4 | |
| No | |
| No | |
| Yes | |
| No | |
| 437.5 | |
| 7 | |
| HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL|RSDS|SSTL-18|SSTL-2 | |
| HSTL|LVCMOS|LVTTL|PCI|PCI-X|SSTL | |
| DDR2 SDRAM|QDRII+SRAM | |
| 1.15 | |
| 1.25 | |
| 1.2|1.5|1.8|2.5|3.3 | |
| 0 | |
| 85 | |
| Commercial | |
| Cyclone | |
| Mounting | Surface Mount |
| Package Height | 1.05 |
| Package Width | 17 |
| Package Length | 17 |
| PCB changed | 256 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 256 | |
| Lead Shape | Ball |
| EDA / CAD Models |
|
