欧盟RoHS指令 | Compliant |
美国出口管制分类ECCN编码 | 3A991d.1. |
环保无铅 | Active |
美国海关商品代码 | 8542.31.00.55 |
Automotive | No |
PPAP | No |
Family Name | MAX® II |
Logic Elements | 570 |
Program Memory Type | Flash |
Memory Size (Kbit) | 8 |
Number of Logic Blocks/Elements | 57 |
Number of Global Clocks | 4 |
Number of I/O Banks | 2 |
Number of Macro Cells | 440 |
Process Technology | 0.18um |
Data Gate | No |
Maximum Number of User I/Os | 116 |
In-System Programmability | Yes |
Number of Inter Dielectric Layers | 6 |
Programmability | Yes |
Reprogrammability Support | No |
Maximum Internal Frequency (MHz) | 1474.9 |
Maximum Clock to Output Delay (ns) | 8.6 |
Maximum Propagation Delay Time (ns) | 14 |
Speed Grade | 8 |
Individual Output Enable Control | Yes |
Minimum Operating Supply Voltage (V) | 1.71 |
Maximum Operating Supply Voltage (V) | 1.89 |
Typical Operating Supply Voltage (V) | 1.8 |
I/O Voltage (V) | 1.5|1.8|2.5|3.3 |
Tolerant Configuration Interface Voltage (V) | 1.8|2.5|3.3|5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 100 |
Supplier Temperature Grade | Industrial |
Packaging | Tray |
Tradename | MAX |
Mounting | Surface Mount |
Package Height | 0.85 |
Package Width | 7 |
Package Length | 7 |
PCB changed | 144 |
Standard Package Name | BGA |
Supplier Package | MBGA |
Pin Count | 144 |
Lead Shape | Ball |