Digital Isolator CMOS/LVCMOS 4-CH 100Mbps 16-Pin SOIC T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | SPI |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 100Mbps |
| Maximum Rise Time (ns) | 3.9 |
| Maximum Fall Time (ns) | 3.9 |
| Maximum Pulse Width Distortion (ns) | 4.2 |
| Output Type | CMOS|LVCMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.25 |
| Maximum Propagation Delay Time (tPHL) (ns) | 17.5 |
| Minimum Isolation Voltage (Vrms) | 5700 |
| Maximum Propagation Delay Time (tPLH) (ns) | 17.5 |
| Maximum Working Insulation Voltage | 2000Vrms |
| Maximum Output Current Drive (mA) | 15 |
| Maximum Power Dissipation (mW) | 200 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
| Forward/Reverse Channels | 3/1 |
| Minimum Common Mode Rejection (kV/us) | 100 |
| Maximum ESD Protection Voltage (kV) | ±1.5@CDM/±6@HBM |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 2.29 |
| Package Width | 14.1(Max) |
| Package Length | 10.4(Max) |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 16 |
| Lead Shape | Gull-wing |
| EDA / CAD Models |
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Digital Isolator CMOS/LVCMOS 4-CH 100Mbps 16-Pin SOIC T/R
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | SPI |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 100Mbps |
| Maximum Rise Time (ns) | 3.9 |
| Maximum Fall Time (ns) | 3.9 |
| Maximum Pulse Width Distortion (ns) | 4.2 |
| Output Type | CMOS|LVCMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.25 |
| Maximum Propagation Delay Time (tPHL) (ns) | 17.5 |
| Minimum Isolation Voltage (Vrms) | 5700 |
| Maximum Propagation Delay Time (tPLH) (ns) | 17.5 |
| Maximum Working Insulation Voltage | 2000Vrms |
| Maximum Output Current Drive (mA) | 15 |
| Maximum Power Dissipation (mW) | 200 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
| Forward/Reverse Channels | 3/1 |
| Minimum Common Mode Rejection (kV/us) | 100 |
| Maximum ESD Protection Voltage (kV) | ±1.5@CDM/±6@HBM |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 2.29 |
| Package Width | 14.1(Max) |
| Package Length | 10.4(Max) |
| PCB changed | 16 |
| Standard Package Name | SO |
| Supplier Package | SOIC |
| Pin Count | 16 |
| Lead Shape | Gull-wing |
| EDA / CAD Models |
制造商
