Bus XCVR Single 8-CH 3-ST 20-Pin TSSOP W Tube
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.10 |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | Bus Transceiver |
| Data Flow Direction | Bi-Directional |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 8 |
| Number of Selection Inputs per Element | 0 |
| Number of Output Enables per Element | 1 Low |
| Number of Input Enables per Element | 0 |
| Number of Direction Control Inputs | 1 Low/High |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Absolute Propagation Delay Time (ns) | 165 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 13@6V|15@4.5V|55@3V|75@2V |
| Propagation Delay Test Condition (pF) | 50 |
| Process Technology | CMOS |
| Input Level | CMOS |
| Output Level | CMOS |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 7.8 |
| Maximum High Level Output Current (mA) | -7.8 |
| Maximum Quiescent Current (uA) | 4 |
| Minimum Operating Supply Voltage (V) | 2 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Power Dissipation (mW) | 450 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tube |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) |
| Package Width | 4.5(Max) |
| Package Length | 6.6(Max) |
| PCB changed | 20 |
| Standard Package Name | SO |
| Supplier Package | TSSOP W |
| Pin Count | 20 |
| Lead Shape | Gull-wing |
| EDA / CAD Models |
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Bus XCVR Single 8-CH 3-ST 20-Pin TSSOP W Tube
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.10 |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | Bus Transceiver |
| Data Flow Direction | Bi-Directional |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 8 |
| Number of Selection Inputs per Element | 0 |
| Number of Output Enables per Element | 1 Low |
| Number of Input Enables per Element | 0 |
| Number of Direction Control Inputs | 1 Low/High |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Absolute Propagation Delay Time (ns) | 165 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 13@6V|15@4.5V|55@3V|75@2V |
| Propagation Delay Test Condition (pF) | 50 |
| Process Technology | CMOS |
| Input Level | CMOS |
| Output Level | CMOS |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 7.8 |
| Maximum High Level Output Current (mA) | -7.8 |
| Maximum Quiescent Current (uA) | 4 |
| Minimum Operating Supply Voltage (V) | 2 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Power Dissipation (mW) | 450 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tube |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) |
| Package Width | 4.5(Max) |
| Package Length | 6.6(Max) |
| PCB changed | 20 |
| Standard Package Name | SO |
| Supplier Package | TSSOP W |
| Pin Count | 20 |
| Lead Shape | Gull-wing |
| EDA / CAD Models |
制造商
