| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 美国海关商品代码 | 8542.32.00.28 |
| Automotive | No |
| PPAP | No |
| DRAM Type | RLDRAM |
| Chip Density (bit) | 576M |
| Organization | 16Mx36 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 2M |
| Number of Bits/Word (bit) | 36 |
| Data Bus Width (bit) | 36 |
| Address Bus Width (bit) | 25 |
| Interface Type | HSTL |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Operating Current (mA) | 1185 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 36 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 0.7(Min) |
| Package Width | 11 |
| Package Length | 18.5 |
| PCB changed | 144 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 144 |
| Lead Shape | Ball |
