| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | NRND |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | NOR |
| Chip Density (bit) | 128M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Bottom|Top |
| Address Width (bit) | 1 |
| Sector Size | 4Kbyte x 4096 |
| Page Size | 256byte |
| Number of Bits/Word (bit) | 1/2/4 |
| Number of Words | 128M/64M/32M |
| Programmability | Yes |
| Timing Type | Synchronous |
| Max. Access Time (ns) | 8 |
| Maximum Erase Time (s) | 160/Chip |
| Maximum Programming Time (ms) | 3/Page |
| Interface Type | Serial-SPI |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 25 |
| Program Current (mA) | 25 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | No |
| ECC Support | No |
| Support of Page Mode | No |
| Minimum Endurance (Cycles) | 100000(Typ) |
| Mounting | Surface Mount |
| Package Height | 0.65(Min) |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 24 |
| Lead Shape | Ball |
