MPU PowerPC 755 Processor RISC 32bit 0.22um 350MHz 2.5V/3.3V 360-Pin CBGA
| 欧盟RoHS指令 | Not Compliant |
| 美国出口管制分类ECCN编码 | 3A001a.2.c. |
| 环保无铅 | Obsolete |
| 美国海关商品代码 | 8542.31.00.50 |
| Automotive | No |
| PPAP | No |
| Family Name | PowerPC 755 Processor |
| Instruction Set Architecture | RISC |
| Device Core | PowerPC |
| Number of CPU Cores | 1 |
| Data Bus Width (bit) | 32 |
| Instruction Cache Size | 32KB |
| Maximum Speed (MHz) | 350 |
| UART | 0 |
| USART | 0 |
| Data Cache Size | 32KB |
| USB | 0 |
| Multiply Accumulate | No |
| SPI | 0 |
| I2C | 0 |
| I2S | 0 |
| CAN | 0 |
| Ethernet | 0 |
| Minimum Operating Supply Voltage (V) | 1.8 |
| Typical Operating Supply Voltage (V) | 2 |
| Maximum Operating Supply Voltage (V) | 2.1 |
| I/O Voltage (V) | 2.5|3.3 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Mounting | Surface Mount |
| Package Height | 2.2(Max) |
| Package Width | 25 |
| Package Length | 25 |
| PCB changed | 360 |
| Standard Package Name | BGA |
| Supplier Package | CBGA |
| Pin Count | 360 |
| Lead Shape | Ball |
| EDA / CAD Models |
|
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MPU PowerPC 755 Processor RISC 32bit 0.22um 350MHz 2.5V/3.3V 360-Pin CBGA
| 欧盟RoHS指令 | Not Compliant |
| 美国出口管制分类ECCN编码 | 3A001a.2.c. |
| 环保无铅 | Obsolete |
| 美国海关商品代码 | 8542.31.00.50 |
| Automotive | No |
| PPAP | No |
| Family Name | PowerPC 755 Processor |
| Instruction Set Architecture | RISC |
| Device Core | PowerPC |
| Number of CPU Cores | 1 |
| Data Bus Width (bit) | 32 |
| Instruction Cache Size | 32KB |
| Maximum Speed (MHz) | 350 |
| UART | 0 |
| USART | 0 |
| Data Cache Size | 32KB |
| USB | 0 |
| Multiply Accumulate | No |
| SPI | 0 |
| I2C | 0 |
| I2S | 0 |
| CAN | 0 |
| Ethernet | 0 |
| Minimum Operating Supply Voltage (V) | 1.8 |
| Typical Operating Supply Voltage (V) | 2 |
| Maximum Operating Supply Voltage (V) | 2.1 |
| I/O Voltage (V) | 2.5|3.3 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Mounting | Surface Mount |
| Package Height | 2.2(Max) |
| Package Width | 25 |
| Package Length | 25 |
| PCB changed | 360 |
| Standard Package Name | BGA |
| Supplier Package | CBGA |
| Pin Count | 360 |
| Lead Shape | Ball |
| EDA / CAD Models |
制造商
