欧盟RoHS指令 | Compliant |
美国出口管制分类ECCN编码 | 3A991b.1.a. |
环保无铅 | Active |
美国海关商品代码 | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Cell Type | NOR |
Chip Density (bit) | 128M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Bottom|Top |
Address Width (bit) | 18 |
Sector Size | 64Kbyte x 256 |
Number of Bits/Word (bit) | 8 |
Number of Words | 16M |
Programmability | Yes |
Timing Type | Synchronous |
Max. Access Time (ns) | 96 |
Maximum Erase Time (s) | 115/Chip |
Maximum Programming Time (ms) | 1.26/Word |
Process Technology | 65nm |
Interface Type | Hyper |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.95 |
Programming Voltage (V) | 1.7 to 2 |
Operating Current (mA) | 180 |
Program Current (mA) | 100 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 105 |
Supplier Temperature Grade | Industrial Plus |
Command Compatible | Yes |
ECC Support | Yes |
Support of Page Mode | Yes |
Minimum Endurance (Cycles) | 100000 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 1(Max) - 0.2(Min) mm |
Package Width | 6 mm |
Package Length | 8 mm |
PCB changed | 24 |
Standard Package Name | BGA |
Supplier Package | Fortified BGA |
Pin Count | 24 |
Lead Shape | Ball |