Infineon Technologies AGS71KL256SC0BHB000Multi-Chip Package Memory
MCP 32Mx8 Flash + 8Mx8 DDR DRAM 3V 24-Pin FBGA Tray Automotive AEC-Q100
| Compliant | |
| 3A991b.1.a. | |
| LTB | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Yes |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.2(Min) |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| 24 | |
| Lead Shape | Ball |
| EDA / CAD Models |