| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | 3A991.b.1.a |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | Unknown |
| PPAP | Unknown |
| Cell Type | MLC NAND |
| Chip Density (bit) | 512G |
| Architecture | Sectored |
| Boot Block | Yes |
| Number of Bits/Word (bit) | 1/4/8 |
| Number of Words | 512G/128G/64G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Process Technology | CMOS |
| Interface Type | Serial e-MMC |
| Maximum Operating Frequency (MHz) | 200 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | Yes |
| ECC Support | No |
| Support of Page Mode | No |
| Mounting | Surface Mount |
| Package Height | 0.92(Max) mm |
| Package Width | 11.5 mm |
| Package Length | 13 mm |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 153 |
| Lead Shape | Ball |
