TLC NAND Flash Serial e-MMC 256G-bit Automotive AEC-Q100 153-Pin BGA Tray
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Unconfirmed |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | TLC NAND |
| Chip Density (bit) | 256G |
| Boot Block | No |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | No |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 1.4 |
| Package Width | 14 |
| Package Length | 18 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 153 |
| EDA / CAD Models |
|
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TLC NAND Flash Serial e-MMC 256G-bit Automotive AEC-Q100 153-Pin BGA Tray
| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Unconfirmed |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | Yes |
| PPAP | Unknown |
| Cell Type | TLC NAND |
| Chip Density (bit) | 256G |
| Boot Block | No |
| Programmability | Yes |
| Timing Type | Synchronous |
| Interface Type | Serial e-MMC |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | No |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 1.4 |
| Package Width | 14 |
| Package Length | 18 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 153 |
| EDA / CAD Models |
制造商
