| 欧盟RoHS指令 | Not Compliant |
| 美国出口管制分类ECCN编码 | EAR99 |
| 环保无铅 | Active |
| 美国海关商品代码 | 8542.39.00.60 |
| SVHC | Yes |
| SVHC超标 | Yes |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | NAND |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 4-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 110@2V|19@6V|22@4.5V |
| Absolute Propagation Delay Time (ns) | 165 |
| Process Technology | CMOS |
| Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 5.2 |
| Maximum High Level Output Current (mA) | -5.2 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Quiescent Current (uA) | 2 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Packaging | Tube |
| Mounting | Through Hole |
| Package Height | 3.56(Max) |
| Package Width | 7.19(Max) |
| Package Length | 19.94(Max) |
| PCB changed | 14 |
| Standard Package Name | DIP |
| Supplier Package | CDIP |
| Pin Count | 14 |
| Lead Shape | Through Hole |
