| 欧盟RoHS指令 | Compliant |
| 美国出口管制分类ECCN编码 | 3A991b.1.a. |
| 环保无铅 | Obsolete |
| 美国海关商品代码 | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | SLC NAND |
| Chip Density (bit) | 2G |
| Architecture | Sectored |
| Boot Block | No |
| Address Width (bit) | 32 |
| Number of Bits/Word (bit) | 2 |
| Number of Words | 1G |
| Programmability | Yes |
| Timing Type | Synchronous |
| Max. Access Time (ns) | 8 |
| Maximum Erase Time (s) | 0.01/Block |
| Maximum Programming Time (ms) | 0.7/Page |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.95 |
| Programming Voltage (V) | 1.7 to 1.95 |
| Operating Current (mA) | 35 |
| Program Current (mA) | 35 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | No |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.85 |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 24 |
