Winbond ElectronicsW63CH2MBVACE TRDRAM 芯片
DRAM Chip Mobile LPDDR3 SDRAM 4Gbit 128Mx32 1.2V/1.8V 178-Pin VFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.36 | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.67 |
| Package Width | 11 |
| Package Length | 11.5 |
| PCB changed | 178 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 178 |
| EDA / CAD Models |