Winbond ElectronicsW66BL6NBUAFIDRAM 芯片
DRAM Chip Mobile LPDDR4 SDRAM 2Gbit 128Mx16 1.1V/1.8V 200-Pin WFBGA
| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.32.00.36 | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.47 |
| Package Width | 10 |
| Package Length | 14.5 |
| PCB changed | 200 |
| Standard Package Name | BGA |
| Supplier Package | WFBGA |
| 200 |
| EDA / CAD Models |