| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Unconfirmed |
| HTS | 8541.29.00.75 |
| Automotive | Unknown |
| PPAP | Unknown |
| Configuration | Single |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Mode of Operation | 1-Carrier W-CDMA|2-Carrier W-CDMA |
| Process Technology | LDMOS |
| Maximum Drain Source Voltage (V) | 65 |
| Maximum Gate Source Voltage (V) | 13 |
| Maximum VSWR | 10 |
| Maximum Drain Source Resistance (mOhm) | 400(Typ)@6.15V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 0.5@28V |
| Typical Forward Transconductance (S) | 0.5 |
| Output Power (W) | 10 |
| Typical Power Gain (dB) | 19.3 |
| Maximum Frequency (MHz) | 2170 |
| Minimum Frequency (MHz) | 2110 |
| Typical Drain Efficiency (%) | 31 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Operating Temperature (°C) | 225 |
| Packaging | Bulk |
| Mounting | Surface Mount |
| Package Height | 2.95(Max) |
| Package Width | 4.14(Max) |
| Package Length | 5.16(Max) |
| PCB changed | 3 |
| Standard Package Name | DIP |
| Supplier Package | CDIP SMD |
| Pin Count | 3 |
