| RoHS (Unión Europea) | Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | LVDS |
| Process Technology | iCoupler |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 2.5Gbps(Min) |
| Maximum Rise Time (ns) | 0.18 |
| Maximum Fall Time (ns) | 0.18 |
| Maximum Propagation Delay Skew (ns) | 0.3 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Maximum Propagation Delay Time (tPHL) (ns) | 2.8 |
| Minimum Isolation Voltage (Vrms) | 5700 |
| Maximum Propagation Delay Time (tPLH) (ns) | 2.8 |
| Maximum Working Insulation Voltage | 849Vp |
| Maximum Power Dissipation (mW) | 2740 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tube |
| Typical Operating Supply Voltage (V) | 1.8 |
| Forward/Reverse Channels | 4/0 |
| Minimum Common Mode Rejection (kV/us) | 40 |
| Supplier Temperature Grade | Industrial |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 2.4(Max) |
| Package Width | 7.6(Max) |
| Package Length | 10.45(Max) |
| PCB changed | 28 |
| Standard Package Name | SO |
| Supplier Package | SOIC W |
| Pin Count | 28 |
| Lead Shape | Gull-wing |
