| RoHS (Unión Europea) | Not Compliant |
| ECCN (Estados Unidos) | EAR99 |
| Estatus de pieza | Active |
| Código HTS | 8542.39.00.10 |
| SVHC | Yes |
| Índice de SEP por encima del límite autorizado | Yes |
| Automotive | No |
| PPAP | No |
| Logic Family | BCT |
| Logic Function | Bus Transceiver |
| Data Flow Direction | Bi-Directional |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 8 |
| Number of Selection Inputs per Element | 0 |
| Number of Output Enables per Element | 1 Low |
| Number of Input Enables per Element | 0 |
| Number of Direction Control Inputs | 1 Low/High |
| Bus Hold | No |
| Polarity | Inverting |
| Absolute Propagation Delay Time (ns) | 12.3 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 5.6@5V |
| Propagation Delay Test Condition (pF) | 50 |
| Process Technology | BiCMOS |
| Input Level | TTL |
| Output Level | TTL |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 48 |
| Maximum High Level Output Current (mA) | -12 |
| Minimum Operating Supply Voltage (V) | 4.5 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Military |
| Packaging | Tube |
| Mounting | Through Hole |
| Package Height | 3.56(Max) mm |
| Package Width | 7.62(Max) mm |
| Package Length | 26.92(Max) mm |
| PCB changed | 20 |
| Standard Package Name | DIP |
| Supplier Package | CDIP |
| Pin Count | 20 |
| Lead Shape | Through Hole |
