Heat Sink Passive BGA/TSSOP/QFN Pin Array SMD Aluminum 70°C/W
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.90.00.00 |
| Automotive | No |
| PPAP | No |
| Type | Passive |
| Material | Aluminum |
| Thermal Resistance | 70°C/W |
| Fin Style | Pin Array |
| Device Cooled | BGA|QFN|TSSOP |
| Attachment Method | Tape |
| Mounting | Surface Mount |
| Product Length (mm) | 6.7 |
| Product Depth (mm) | 6.7 |
| Product Height (mm) | 7.6 |
| EDA / CAD Models |
|
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Heat Sink Passive BGA/TSSOP/QFN Pin Array SMD Aluminum 70°C/W
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.90.00.00 |
| Automotive | No |
| PPAP | No |
| Type | Passive |
| Material | Aluminum |
| Thermal Resistance | 70°C/W |
| Fin Style | Pin Array |
| Device Cooled | BGA|QFN|TSSOP |
| Attachment Method | Tape |
| Mounting | Surface Mount |
| Product Length (mm) | 6.7 |
| Product Depth (mm) | 6.7 |
| Product Height (mm) | 7.6 |
| EDA / CAD Models |
注目の製品
